Scenarios: 5G/6G base stations, optical modules, satellite communications, data center switchesCharacteristics: high-frequency and high-speed, low loss, high multilayer

Scenarios: mobile phones, tablets, wearable devices, smart home
Characteristics: lightweight, flexible, highly integrated

Scenarios: Autonomous driving, BMS, in-vehicle system, charging pile
Characteristics: High temperature resistance, high reliability, rigid-flex combination

Scenarios: Industrial robots, PLCs, CT scanners, implantable medical devices
Characteristics: Anti-interference, wide temperature range, biocompatibility

Scenarios: Satellite, Missile, Fighter Aircraft Avionics, Space Station
Characteristics: Adaptability to extreme environments, lightweight, impact resistance

Scene: AI server, GPU, brain-computer interface, bioelectronics
Characteristics: ultra-high layers, large size, flexible circuit